June 6th, 2024 Minimizing die fracture in 3DIC die integration XYALIS, in collaboration with Mosis, has published a new article in the Journal of Micro/Nanopatterning, Materials, and Metrology about « Minimizing die fracture in 3DIC die integration ». The demand for high-performance semiconductor products has led to reduced wafer feature size, lowered package size, and an ever-thinner die for advanced three-dimensional (3D) packaging. Dies down to a...
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April 30th, 2019 Geometry-based signature for layout database comparison Grenoble – May 31st, 2018 – XYALIS unveils a new method to compare layouts databases using a geometry-based signature enabling a safe and fast traceability process. Read the article on TechDesignForum. Exchanges of layout descriptions between teams involved in modern integrated circuit (IC) development and production increase in terms of rate, value, and size. Therefore it...
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November 19th, 2018 New release of our hybrid dummy fill tool, GTstyle GRENOBLE, France, August 21st, 2007 In addition to all exclusive functionnalities such as roughness management or parasitics reduction, GTstyle v2.2 provides new great features:     Full Oasis compatibility     Management of multiple size dummy cells     Automatic interconnection of dummy cells     Management of non orthogonal grids     Critical nets specific keep away distance GTstyle...
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November 19th, 2018 STMicroelectronics QUALIFIES XYALIS GTSMOOTH OXIDE THICKNESS ESTIMATION TECHNOLOGY Grenoble, France – XYALIS announced today that STMicrolectronics, after several month of validation, has qualified GTsmooth post CMP oxide thickness estimation capabilities. With the deployment of latest advanced process technologies, yield performance degradation due to non-uniform feature density requires an accurate verification of the metal-fill effectiveness prior mask set manufacturing. GTsmooth, introduced last year, offers...
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June 21st, 2016 XYALIS announce an Advanced Methodology for Building CMP Models GRENOBLE, France – June 1st, 2007 XYALIS will be able to provide high accuracy thickness measurements on wafers. XYALIS announce today that thanks to « non destructive » nanometric measurement equipment’s, XYALIS is able to build Chemo Mechanical Planarization (CMP) models. These models are used for estimating the critical areas where dummy filling is needed to smooth...
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June 21st, 2016 DelfMEMS selects XYALIS’s MDP tools XYALIS and DelfMEMS announce that DelfMEMS selected XYALIS’s Mask Data preparation suite to address the challenges of the very sensitive mask design flow required by RF MEMS “This was an exciting challenge to completely automate the Mask Design operation for such a complex and demanding environment as RF MEMS.”  said Philippe Morey-Chaisemartin, XYALIS’s CTO. Thanks...
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June 21st, 2016 XYALIS and SII NanoTechnology announce strategic collaboration GRENOBLE, France, January 31st, 2011 Chiba, Japan, January 31th, 2011 XYALIS, a leader in Mask Data Preparation software, and SII NanoTechnology, a leader in Photomask Verification software, announced today that they have signed a strategic cooperation agreement to broaden availability of their Photomask Data Preparation solutions, strengthen worldwide support, and develop a unified front-to-back flow...
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June 21st, 2016 XYALIS marks North American Operations expansion with official opening of an office in San Jose GRENOBLE, France, March 21st, 2008 Xyalis marks North American Operations expansion with official opening of an office in San Jose, California, announces Eric Beisser – CEO of Xyalis. Xyalis, the leader in layout finishing solutions, today officially announced the opening of its North American office and the appointment of Sylvie Hurat as Marketing Account Manager...
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June 17th, 2024 XYALIS GTstyle dummy fill engine achieves unsurpassed performance for 28nm highly parallel processor Grenoble, October 29th, 2012 – XYALIS and KALRAY announce that XYALIS GTstyle has successfully addressed the advanced dummy fill challenges of KALRAY’s MPPA-256 manycore processor, designed using state of the art 28nm process. With its complex process rules from both analog parts requiring dedicated dummy fill procedures and large digital areas with timing and race...
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